• Including vision system and angular squeegee printing, capable of printing at different angles
• Solder paste height can be varied even within a single circuit board with changeable stencil thickness
• Fine pitch capable to 16 mils

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• For missing & excess solder and solder bridges
• To improve first-time yield, reduce rework and reduce customer PPM

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Small Components

• Capable of fine pitch and ultra-fine pitch to 0.4mm
• 0.55 sec/shot for small chips
• Placement accuracy +/- 0.000098 in.

Large Components

• Components up to 74 x 74mm and heights of 10mm to 25.4mm

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• Including reflow and laser soldering
• Selective wave soldering available for through-hole components

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• To detect potential failure modes from components shifting, tombstoning or reversed
• To detect solder bridges and correct solder fillet
• Reduces customer PPM and reduces in-line inspection time

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• Designed for complex and heavily integrated circuit boards

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• To protect against moisture, chemicals and dirt
• Applied selectively via robotic spray

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• For improved precision and dust elimination
• Available for circuit boards up to 18"

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• Experience with simulating a variety of customer applications, including displays, shifters, angle sensors and human interface modules

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